With so many August events, we chose to focus this BWR episode exclusively on Hot Chips 2026. Joe and Bob discuss key disclosures, including Intel’s Diamond Rapids Xeon, AMD’s Helios MI450 platform, NVIDIA’s LPX/LPU architecture, Cerebras’s CS-4 wafer-scale engine, and OpenAI’s Jalapeño ASIC. As always, you can find timestamps on YouTube if you want to skip to items of interest.

Joe and I will be at live events in August. Thanks to LightCounting , I will be at the OCP APAC Summit on August 11-12, moderating panels in the Photonics track and the Chiplets & Advanced Packaging track. Joe will be at Hot Chips at Stanford on August 24-25, and I will be attending virtually. We kick off The Byrne-Wheeler Report with a Hot Chips preview. After that, we review AMD's Advancing AI Day disclosures including GPUs, CPUs, racks, and customer announcements. My audience should be interested in Astera Lab's 3.2T Taurus announcement, which includes something new and different. And with CPUs back in vogue, Joe covers Nvidia's Vera disclosures. You can find timestamps on YouTube if you want to jump to items of interest. As always, thanks for watching!

In Episode 3, Joe and Bob discuss OCP-related announcements and the AMD-OpenAI deal. 00:00:26 OCP recap 00:01 AMD Helios rack 00:06:46 Broadcom Thor Ultra 00:12:32 Intel Crescent Island 00:19:11 AMD-OpenAI deal 00:26:33 Signing off