Source: Hot Chips The accelerated life cycles that AI is driving woke up a normally sleepy August. Held virtually, Hot Interconnects (HotI 2025) spanned three days with a mix of invited talks, sponsor talks, and tutorials. Some of the brief sponsor talks merely previewed larger disclosures at Hot Chips, which was held at Stanford University the following week. This year, Hot Chips’ agenda included an Optical session that featured three startups plus Nvidia. It also included Networking and Machine Learning (ML) sessions with talks from leading vendors. Although Nvidia was the marquee name in Hot Chips' Optical session, Gilad Shainer's talk on co-packaged silicon photonics lacked any new technical details on the company's CPO switches. Instead, the company used the event to announce Spectrum-XGS, which extends its Spectrum-X Ethernet solution across data centers. Nvidia calls this "scale-across" networking because it primarily targets data center clusters, but it is...

Last year, module vendors demonstrated the first 1.6T optical modules, and this year DSP vendors looked ahead to second-generation 1.6T module designs. Whereas the first 1.6T modules connect a 16x100G host interface to 8x200G optics (16:8), next-generation designs will work with forthcoming 200G/lane switch ASICs, as shown in the top row of the figure. Broadcom disclosed its Sian2 1.6T 8:8 DSP at a March investor event, and Marvell followed by announcing its similar Nova 2 at OFC. Not wanting to be left out of the 1.6T landscape, MaxLinear pre-announced Rushmore, which similarly targets 8:8 designs. Although the company withheld product details, it disclosed Samsung Foundry as its manufacturing partner for Rushmore, setting it apart from competitors using TSMC. Source: Broadcom Progress on linear pluggable optics (LPO) and other less-than-full-DSP variants was evident at 100G/lane, but vendors also set the stage for 200G/lane. Last November, Credo Semiconductor was first to announc...